发明名称 DEVICE FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device for treating a substrate with which the wearing of support pins and the crushing of a substrate can be prevented. SOLUTION: There are provided a substrate supporting base 1 which supports the substrate W and which is a disk-shaped plate rotated horizontally by a rotation means, pillar-shaped supports 14 supporting the substrate W by means of point contacts with the reverse faces of a plurality of substrates W arranged on the above supporting base 1, adsorbing bodies 15 which adsorb to support the outer edges of the substrates W supported on the above supporting base 1 by the supports 14, and supply units 5, 6, 9 of a treating liquid which supply the treating liquid to the upper surface and/or the lower surface of the substrate W supported on the above supporting base 1.
申请公布号 JP2002059066(A) 申请公布日期 2002.02.26
申请号 JP20000243661 申请日期 2000.08.11
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 MIZUKAWA SHIGERU;MURATA TAKASHI;NAKADA KATSUTOSHI;MATSUMOTO SHUNJI
分类号 G03F7/16;B05C11/08;G03F7/30;H01L21/027;H01L21/304;H01L21/306;H01L21/68;H01L21/683 主分类号 G03F7/16
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