发明名称 |
DEVICE FOR TREATING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a device for treating a substrate with which the wearing of support pins and the crushing of a substrate can be prevented. SOLUTION: There are provided a substrate supporting base 1 which supports the substrate W and which is a disk-shaped plate rotated horizontally by a rotation means, pillar-shaped supports 14 supporting the substrate W by means of point contacts with the reverse faces of a plurality of substrates W arranged on the above supporting base 1, adsorbing bodies 15 which adsorb to support the outer edges of the substrates W supported on the above supporting base 1 by the supports 14, and supply units 5, 6, 9 of a treating liquid which supply the treating liquid to the upper surface and/or the lower surface of the substrate W supported on the above supporting base 1. |
申请公布号 |
JP2002059066(A) |
申请公布日期 |
2002.02.26 |
申请号 |
JP20000243661 |
申请日期 |
2000.08.11 |
申请人 |
SUMITOMO PRECISION PROD CO LTD |
发明人 |
MIZUKAWA SHIGERU;MURATA TAKASHI;NAKADA KATSUTOSHI;MATSUMOTO SHUNJI |
分类号 |
G03F7/16;B05C11/08;G03F7/30;H01L21/027;H01L21/304;H01L21/306;H01L21/68;H01L21/683 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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