发明名称 RESIN COMPOSTION AND RESIN MOLDED PRODUCT BY USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition for welding, utilizable in electric and electronic fields, an automotive field and other of various kinds of industrial field, excellent in mechanical strength, impact resistance, heat resistance and chemical resistance, and excellent in stability of the weld strength, and to provide a molded product by using the composition. SOLUTION: This resin composition comprising total 100 pts.wt. of 5-60 pts.wt. polyphenylene ether resin, and 40-95 pts.wt. crystalline polypropylene resin, and 1-30 pts.wt. hydrogenated product of a vinyl aromatic compound- conjugate diene copolymer is characterized in that the crystalline polypropylene resin and the polyphenylene ether resin form a continuous phase and a dispersed phase respectively, and the ratio Lw/Ln of the arithmetic mean (Ln) of the distances between particle walls of the dispersed phase, to the weighted mean (Lw) of the distances between the particle walls is 1.0-3.0.</p>
申请公布号 JP2002060562(A) 申请公布日期 2002.02.26
申请号 JP20010164320 申请日期 2001.05.31
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 KURASAWA YOSHIHIRO;OBAYASHI NAOTO
分类号 B65D1/22;C08J5/00;C08L23/10;C08L53/00;C08L53/02;C08L71/12;H01M2/02;(IPC1-7):C08L23/10 主分类号 B65D1/22
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