LOW-ELASTIC ADHESIVE, LOW-ELASTIC ADHESIVE MEMBER, SUBSTRATE FOR LOADING SEMICONDUCTOR HAVING LOW-ELASTIC ADHESIVE MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a low-elastic adhesive having heat and moisture resistances required for packaging a semiconductor chip having a great difference in coefficient of thermal expansion in a wiring substrate and capable of exhibiting good characteristics for temperature cycling tests and a low-elastic adhesive member, etc., using the low-elastic adhesive. SOLUTION: This low-elastic adhesive comprises (1) 100 pts.wt. of the sum of an epoxy resin and a curing agent therefor, (2) 50-300 pts.wt. of an epoxy group-containing acrylic copolymer containing 2-6 wt.% of glycidyl (meth) acrylate and having >=-10 deg.C Tg (glass transition temperature) and >=800,000 number-average molecular weight, (3) 0.1-10 pts.wt. of a curing accelerator, (4) 20-60 pts.wt. of a silicone rubber filler and (5) 0.1-10 pts.wt. of a coupling agent. The low-elastic adhesive member, etc., use the low-elastic adhesive.