发明名称 DIE APPARATUS
摘要 PROBLEM TO BE SOLVED: To precisely mount a die apparatus to a prescribed position of a die placing base without skill as well as in one touch, to sufficiently exhibit a function of the die apparatus and to eliminate the wear between a guide of the die placing base and a placing plate to place/set the die apparatus. SOLUTION: In the die apparatus which is provided with a die plate part at least formed with a through hole /a punch plate part arranged with a punch, which is set at a prescribed position of a die placing base through the guide and conducts punching, the placing plate 3 placing the die apparatus thereon, going-in/out the die placing base 1 and setting thereat is constituted so that a die apparatus placing plane is formed into a taper shape 11 tapering off in a die going-in direction of the die apparatus placing base 1, the guide 12 has a tapered shape corresponding to the taper 11 of the placing plate 3 and is arranged to the die placing base 1.
申请公布号 JP2002059228(A) 申请公布日期 2002.02.26
申请号 JP20000243519 申请日期 2000.08.11
申请人 MITSUI HIGH TEC INC 发明人 ITO YOSHIYASU
分类号 B21D28/34;B21D37/14;(IPC1-7):B21D37/14 主分类号 B21D28/34
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