发明名称 |
COMPOSITION AND METHOD FOR STRIPPING SOLDER AND TIN FROM PRINTED CIRCUIT BOARDS |
摘要 |
A composition and method for stripping tin and solder and the underlying tin -copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder a nd tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between prin ted circuits.
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申请公布号 |
CA2248497(C) |
申请公布日期 |
2002.02.26 |
申请号 |
CA19982248497 |
申请日期 |
1998.09.28 |
申请人 |
MORTON INTERNATIONAL, INC. |
发明人 |
FAKLER, JOHN T.;JOHNSON, TODD II |
分类号 |
C23F1/30;C23F1/44;H05K3/06;(IPC1-7):C23F1/18;H05K3/22 |
主分类号 |
C23F1/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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