| 摘要 |
There is a disclosed a liquid delivery system (LDS) used upon deposition of a copper wire through chemical vapor deposition method in the process of manufacturing a semiconductor device. The LDS comprises a copper liquid materials supply [means] apparatus for providing copper liquid materials of a room temperature to a vaporizer [means] via an orifice which is rotating at a constant speed; a carrier gas supply [means] apparatus for jetting a carrier gas kept to the temperature at which copper will be vaporized via jet nozzles and forming the copper liquid materials to be supplied to said vaporizer [means] via said orifice with micro drops; and a jet [means] device for jetting vaporized copper stream to a reactive chamber, wherein said micro drops being vaporized in the vaporizer [means]. According to the present invention, it can solve the problems such as clogging of a vaporizer, a low reproduction and a low deposition speed, which are problematic in the conventional bubbler and direct liquid injection (DLI) apparatuses.
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