| 摘要 |
A method for potting a populated assembly using an anti-vibration potting compound, a populated assembly and a controller having a populated assembly, include a circuit configuration potted by using an anti-vibration, thixotropic embedding compound. The circuit configuration includes a baseplate, an electrical circuit mounted thereon and having electrical components, and a flexible printed circuit board passing through to the circuit and making electrical contact with the circuit through lead wires. The components on one hand, and the contact points for the lead wires on the flexible printed circuit board on the other hand, are potted by using the embedding compound in separate process steps.
|
