| 摘要 |
PURPOSE: An apparatus for grinding a semiconductor wafer is provided to improve a capacity for removing slurry and to prevent a scratch on a grind surface of the wafer, by attaching a poly vinyl alcohol pad of a soft material to the upper surface of a platen for eliminating the slurry. CONSTITUTION: Several heads(12) for vacuum-absorbing the wafer(11) are installed in a head assembly(13). The first/second grind platens(15,15') and the slurry elimination platen(16) are sequentially disposed under the head assembly. The poly vinyl alcohol pad(20) of a soft material is attached to the upper surface of the slurry elimination platen to completely eliminate the slurry.
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