发明名称 |
Bathless wafer measurement apparatus and method |
摘要 |
A wafer measurement apparatus (10, 110) and method for measuring a film thickness property of a wafer (30) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck (16) having an upper surface (20) for supporting the wafer, and a perimeter (18). Also included is a metrology module (50) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window (60) with a lower surface (64) arranged substantially parallel to the chuck upper surface, thereby defining an open volume (68). The apparatus includes a water supply system in fluid communication with the open volume via nozzles (70) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment (40) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described. |
申请公布号 |
AU7924201(A) |
申请公布日期 |
2002.02.25 |
申请号 |
AU20010079242 |
申请日期 |
2001.08.09 |
申请人 |
SENSYS INSTRUMENTS CORPORATION |
发明人 |
MICHAEL WEBER-GRABAU;IVELIN A. ANGUELOV;EDRIC H. TONG;ADAM E. NORTON;FRED E. STANKE;BADRU D. HYATT |
分类号 |
B24B37/013;B24B49/02;B24B49/12 |
主分类号 |
B24B37/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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