METHOD FOR TRANSFERRING WAFER IN MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for transferring a wafer in manufacturing a semiconductor device is provided to prevent damage to the wafer which is not located in a predetermined position inside a process chamber, by driving a wafer transfer apparatus and a transfer unit only when the wafer is received in a right position. CONSTITUTION: A cassette in which semiconductor wafers are received is mounted on a mounting unit while the semiconductor wafers are determined to be received in a right position. The cassette is vertically transferred by the mounting unit while the semiconductor wafers are determined to be received in a right position. The transfer unit transfers the semiconductor wafers to the process chamber one by one while the semiconductor wafers left in the cassette are determined to be received in a right position. If the semiconductor wafers are not located in a right position, the mounting unit and the transfer unit are not driven and an alarm signal is generated.