APPARATUS FOR FABRICATING SEMICONDUCTOR INCLUDING WAFER COOLING APPARATUS

摘要

PURPOSE: An apparatus for fabricating a semiconductor including a wafer cooling apparatus is provided to reduce a wafer from being warped by a rapid temperature variation, by repeatedly performing a process for cooling an annealed wafer at a temperature from an annealing temperature to a cooling temperature and by ultimately reducing the temperature of the annealed wafer to a desired temperature. CONSTITUTION: A fabrication process fabricates a semiconductor device on the wafer at the first temperature condition. The first cooling apparatus reduces the temperature of a heated wafer to the second temperature lower than the first temperature. The second cooling apparatus reduces the temperature of the wafer to the third temperature lower than the second temperature.