| 摘要 |
PURPOSE: A pad structure of an apparatus for grinding a semiconductor wafer is provided to prevent a scratch from being generated on the lower surface of the wafer by a corner portion of a friction lattice part formed on the pad, by forming a round part in the corner portion of the friction lattice part. CONSTITUTION: A head(12) for vacuum-absorbing a wafer(11) is installed, capable of rotating and moving up/down. A platen(14) is installed under the head, capable of rotating by a motor(15). A pad(13) is attached to the upper surface of the platen. A slurry supply pipe(16) for supplying slurry to the pad is installed in a position over a part of the platen.
|
