发明名称 |
METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for forming a capacitor of a semiconductor device is provided to improve a characteristic and reliability, by preventing a lifting phenomenon of a storage electrode having a three-dimensional structure such that the lifting phenomenon occurs in removing a sacrificial insulation layer. CONSTITUTION: A bit line(17) is formed on a lower insulation layer(13) having the first contact plug(15). The second contact plug(19) coupled to the first contact plug is formed by using a storage electrode contact mask. An interlayer dielectric(21) and the sacrificial insulation layer are stacked on the entire surface. The sacrificial insulation layer and the interlayer dielectric are etched by using a contact mask larger than the storage electrode contact mask to form a trench between the second contact plug and the interlayer dielectric. Polysilicon(25) filling the trench is formed on the entire surface. A conductive layer(27) for the storage electrode is formed on the polysilicon. The conductive layer for the storage electrode and the polysilicon are planarization-etched to eliminate the exposed sacrificial insulation layer.
|
申请公布号 |
KR20020014242(A) |
申请公布日期 |
2002.02.25 |
申请号 |
KR20000047413 |
申请日期 |
2000.08.17 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
HWANG, CHANG YEON;KIM, HUN SANG |
分类号 |
H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|