发明名称 APPARATUS FOR FORMING THIN FILM HAVING REFLECTION UNIT
摘要 PURPOSE: An apparatus for forming a thin film having a reflection unit is provided to prevent contamination particles from being dropped to a wafer, by forming the reflection unit on a susceptor such that the reflection unit reflects heat energy radiated from the susceptor to the wafer. CONSTITUTION: A wafer loading region(43) is formed on a wafer heating unit(40). A shower head(52) sprays source gas capable of reaching the surface of the wafer when the wafer is loaded to the wafer loading region, installed in a position facing the wafer loading region. The reflection unit(44) reflects the heat energy radiated from the wafer loading region to the wafer loading region, installed between the shower head and the wafer heating unit. A pumping unit(56) controls the inner pressure of a chamber(38) including the wafer heating unit, the shower head and the reflection unit, and exhausts reaction byproducts generated inside the chamber to the outside of the chamber.
申请公布号 KR20020014217(A) 申请公布日期 2002.02.25
申请号 KR20000047386 申请日期 2000.08.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KWON, HEUNG AN;LIM, JEONG SU;MUN, GANG UK;SON, YONG UN
分类号 C23C16/44;C23C16/46;C23C16/56;C30B25/10;C30B31/12;H01L21/205;(IPC1-7):H01L21/31 主分类号 C23C16/44
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