发明名称 WIRE BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wire bonding device to stably operate at high speed without exciting the vibrations of an XY stage and a capillary as movable parts. SOLUTION: Since the wire bonding device is provided with a synthetic target orbit generating part 108 for generating a target orbit synthesizing the decelerating part of an outgoing path and the accelerating part of an incoming path to one orbit concerning an orbit part to become a reciprocating movement in the target orbit showing an operating process of any one of or both an XY stage 102 and a capillary 104 of the wire bonding device, the cycle of the synthesized target acceleration orbit can be set long while shortening required time to the end of the orbit and the wire bonding device can be stably operated at high speed without exciting the vibration mode of the XY stage 102 and the capillary 104 as movable parts.</p>
申请公布号 JP2002057185(A) 申请公布日期 2002.02.22
申请号 JP20000239126 申请日期 2000.08.07
申请人 NEC CORP 发明人 TODA KOJI
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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