| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable and industrially superior flexible printed wiring board exhibiting superior heat load resistant after electroless plating. SOLUTION: The flexible printed wiring board employs a polyimide film, having fine irregularities on the surface in which the surface area is in the range of 1.5-15 times as wide as that of a smooth polyimide film, and the height of the irregularities is in the range of 10-50 nm.
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