METHOD FOR PREPARING DATA FOR DEFECT ANALYSIS IN EXAMINATION OF ELECTRONIC DEVICE AND SYSTEM FOR ANALYZING EXAMINATION DATA FOR ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To narrow down a defect factor caused by the defect of an electronic device for forming the circuit patterns of multiple layers by analyzing the defect to occur in each of layers of the electronic device. SOLUTION: On the basis of the result of a defect examination to be performed each time the layer of a wafer is formed, processing 41 is performed for making correspondent defect coordinates between respective examinations to recognize the defect and further, processing 43 is performed for deciding the size of that defect for each recognized defect to unify the defect sizes different for each examination of the defect. Next, processing 45 is performed for excluding fine defects to narrow down defect data as a target of defect analysis.