| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer washing device with which sufficient clean air can be supplied by a downflow, diffusion of a chemical agent atmosphere can be prevented in an appropriately closed structure and reattachment of mist upon drying can be prevented when chemical agent washing and spin drying are performed in a bath. SOLUTION: A downflow is formed in a washing bath 11 by providing a suction port 12 on top thereof and an exhaust port 17 at the bottom thereof. A wafer to be washed Wf is rotated in the washing bath 11 so that the wafer to be washed Wf can be washed and dried in the same washing bath 11. This wafer washing device is equipped with water jetting nozzles 14, 14 for forming a water curtain covering the suction port 12 with a curtain made of water.
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