| 摘要 |
PROBLEM TO BE SOLVED: To provide a small composite integrated circuit by integrating a thin film capacitor which is large in capacity and a thin film coil on a semiconductor substrate where an integrated circuit has been provided. SOLUTION: A capacitor and a thin film coil are laminated on the surface of a semiconductor substrate opposite to its other surface on which an integrated circuit has been formed for the formation of a composite integrated circuit, or another semiconductor substrate on which a capacitor and a thin film coil have been formed is pasted on the semiconductor substrate for the formation of a composite integrated circuit. Furthermore, the composite integrated circuit is made a distributed constant circuit, by which a circuit of lower ESR can be realized.
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