| 摘要 |
PROBLEM TO BE SOLVED: To provide the coating method of a circuit board, which can make a frame type member for injecting a resin and the circuit board closely adhere to each other all over. SOLUTION: The coating method of a circuit board is characterized in that the coating method comprises a process that a frame type member having a first aperture formed in such a way as to correspond to a prescribed region to be coated with a resin on a substrate is placed on the surface of the substrate mounted with an electronic component, a setting process that the frame type member and the substrate are made to closely adhere to each other and a process that with a resin injected in the first aperture, this resin is cured and the setting process is performed by a method, where a press plate member having a second aperture formed in such a way as to correspond to the first aperture is placed on the frame type member and the press plate member is fixed on the substrate in such a way that the frame type member is pressed to the substrate.
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