| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus heat-radiating structure for effective heat radiation, where high-density mounting is allowed for reduced size and cost, with high dust protecting effect. SOLUTION: An outer box 3 is partitioned into a board unit housing part 4 and a heat radiation part 5, with the board unit housing part having a closed structure, while the outside air is allowed to flow a through the heat radiation part. A board unit 1 is housed in the board unit housing part, and the heat- radiating part is provided with a heat sink 6, with the board unit being connected to the heat sink using a heat pipe 8.
|
