| 摘要 |
PROBLEM TO BE SOLVED: To provide soldering method and device that can prevent bridge fault, where electrodes are mutually connected by excessively supplying solder, and can a soldering material having high melting point. SOLUTION: In this soldering method, the heated and molten solder material is supplied for jointing a printed circuit board to electronic components. The soldering method includes a first process, that allows flux to come into contact with molten solder after the flux is supplied to a part to be jointed, and a second process that allows the flux to brought into contact with the molten solder again for removing excessive solder, after the flux is re-supplied. Also, the soldering method has a plurality of flux supply and molten solder contact means, and the flux supply and molten solder contact means are provided alternately.
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