ROTARY WAFER TREATMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To avoid a phenomenon that a chemical agent remains on the rear surface of a wafer after washing and drying the wafer in wafer treatment where a chemical agent is supplied to surfaces of a wafer while rotating the wafer by a rotor. SOLUTION: As a washing means, there are provided a spray nozzle 80 for spraying a surface of a wafer 10 with pure water, a pure water nozzle 50 for spraying the rear surface of the wafer 10 with pure water and a pure water nozzle 60 for spraying the outer periphery of the rear surface of a rotor 20 with pure water. By washing the outer periphery of the rear surface of the rotor 20 upon washing, reattachment of a chemical agent from the outer periphery of the rear surface of the rotor 20 to the rear surface of the wafer 10 is prevented.