| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-baking device that prevents heat radiation in a wafer edge for uniformly maintaining the temperature of a wafer. SOLUTION: This semiconductor wafer-baking device is composed of a heating plate where the wafer is mounted, a wafer guide part that guides the wafer so that the wafer is properly aligned on the heating plate, and a release heat compensation part that is positioned at an upper part in the wafer guide part for compensating for heat released from the edge of the wafer. A heating device (heat wire) is incorporated into the release heat compensation part, and the heating plate and release heat compensation part can simultaneously or independently apply electric power.
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