| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having electronic components and bonding wires sealed with a gel wherein the strain or breaking of the bonding wires is suppressed. SOLUTION: Electronic components 9 are mounted on a ceramic board 3 and electrically connected to the board 3 with bonding wires 11. A silicone rubber-made enclosure 12 is provided for enclosing a layout area of the electronic components 9 and the bonding wires 11, and filled with a silicone gel 13 to seal the electronic components 9 and the bonding wires 11 with the gel 13. The gel 13 is 2.5 mm high and has a rectangular shape having a long side of 39.5 mm and a short side of 14.5 mm in a view normal to the ceramic board 3. The penetration of the gel 13 is 128±10 mm/10.</p> |
