| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an improved interconnection circuit that has high integration density, and consists of a conductive electrical path, a pad, and a micro-via. SOLUTION: A first layer 103 that contains a synthetic object, having capability of inducing metal covering in the post treatment, and is made of an insulating, photosensitive resin is formed on a substrate 101 having metal covering 102 on a surface (a). The first layer is exposed and developed for exposing to the metal covering 102 on the substrate (b). While a second layer 105, that forms selective protection and is made of the photosensitive resin, is being used, the metallic conductive path and micro-via are formed in the first layer made of the insulating, photosensitive resin, and on the surface of a part exposed in the step (b) by the metal covering. |
