发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component exhibiting a high impact resistance. SOLUTION: Buffer parts 15 of relatively soft synthetic resin, synthetic rubber or the like in rectangular form are provided by a method such as pasting or printing on two sides in the direction of height of a component body 12 of a capacitor array 11. When the capacitor array is mounted on a substrate, even if a shock due to a fall or a collision is applied to the capacitor array 11, the shock is relaxed by the buffer parts 15 positioned between the capacitor array 11 and the substrate SU. The stress produced at the junction and its neighborhood by application of the shock is relatively reduced by the shock reducing function and the occurrence of cracks in the parts is prevented.
申请公布号 JP2002057059(A) 申请公布日期 2002.02.22
申请号 JP20000239912 申请日期 2000.08.08
申请人 TAIYO YUDEN CO LTD 发明人 MOGI HIROYUKI;MATSUSHITA HARUHIKO;INOUE YASUSHI
分类号 H01G4/12;H01G2/06;H01G4/252;H01G4/30;(IPC1-7):H01G2/06 主分类号 H01G4/12
代理机构 代理人
主权项
地址