| 摘要 |
PROBLEM TO BE SOLVED: To improve a mounting quality in a peripheral type semiconductor device and to prevent its leads from dropping out of it. SOLUTION: The peripheral type semiconductor device comprises a sealing portion 3 formed to seal therein a semiconductor chip 2 with resin; a tab 1b for supporting thereon the semiconductor chip 2; a plurality of leads 1a; and wires 4 by each of which each pad of the semiconductor chip 2 and each correspondent lead 1a thereto are connected, with each lead 1a having each connected portion 1g arranged in line with other connected portions 1g on the peripheral edge portion of a rear surface 3a of the sealing portion 3 and exposed to the external and having each bent portion 1h bent from each connected portion 1g, to provide it extendedly from on the end portion of the rear surface 3a of the sealing portion 3 to on each side surface 3b of the sealing portion 3. Further, each solder fillet 11 is formed high, when mounting a QFN as to improve the mounting quality of the QFN and as to prevent each lead 1a from dropping out of the sealing portion 3, by providing in each lead 1a respective bent portion 1h bent from each connected portion 1g toward the upper side of the sealing portion 3, and by extendedly providing each bent portion 1h from on the end portion of the rear surface 3a of the sealing portion 3 to on its side surface 3b. |
