| 摘要 |
<p>PURPOSE: A bump structure of a semiconductor device is provided to prevent test reliability from being deteriorated by a damaged part and particles on a bump by dividing a chip pad into two parts and testing an outer pad part. CONSTITUTION: A plurality of pad electrodes(22) are formed on a semiconductor chip. A test electrode(23) is separately formed in a side of the semiconductor chip, corresponding to the pad electrode. A passivation layer(24) is formed in a region except the pad electrode and the test electrode. A metal layer is built in a portion adjacent to the pad electrode on the pad electrode and the test electrode. A bump(27) is formed on the metal layer.</p> |
