MOUNTING STRUCTURE AND MOUNTING METHOD OF CHIP-LIKE PASSIVE ELEMENT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To mount a chip component (chip-like passive element), e.g. a chip capacitor, stably and to improve frequency characteristics, e.g. high frequency characteristics. SOLUTION: A chip-like passive element 13 having electrode parts P1, P2 at the opposite ends is mounted on a wiring board 11 having an element mounting face on which electrode pads 29a are formed such that the opposite end direction of the chip-like passive element 13 is perpendicular to the element mounting face, and the electrode part P1 on one end side is bonded to the electrode pads 29a. A semiconductor chip 12 having electrode pads formed on one side thereof is mounted on the wiring board 11 mounting the chip-like passive element 13 through electrical connection of the electrode pads of the semiconductor chip and the electrode part on the other side of the chip-like passive element 13.