发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a new step and a protective element including a low breakdown voltage, without having to add a photomask, and to provide a method for manufacturing the same. SOLUTION: The semiconductor device comprises a first conductivity-type substrate, an electrostatic protective element made of a second conductivity-type heavily doped diffusion layer formed on a surface of the substrate, a semiconductor element including a source, a drain and a gate electrode,and a concentration first conductivity type diffusion layer of concentration higher than that of the substrate and provided on the entire lower surface of the second conductivity- type heavily doped diffusion layer. A method for manufacturing the semiconductor device is provided.
申请公布号 JP2002057222(A) 申请公布日期 2002.02.22
申请号 JP20000244881 申请日期 2000.08.11
申请人 SHARP CORP 发明人 SHIMOMURA NARAKAZU
分类号 H01L27/04;H01L21/336;H01L21/822;H01L21/8238;H01L27/02;H01L27/092;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01L27/04
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