发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a proper solder junction between parts and a board. SOLUTION: Part conveyance arms 38 and 40 convey a part W to a solder junction position on a board B, and maintain the part W in a prescribed junction attitude at the solder junction position. A gas supply nozzle 47 is provided in a part retention hand 46 supported by the part conveyance arm 40 and supplied a heating gas for melting solder being coated to a junction part in advance, and a cooling gas for cooling the molten solder, thus fixing the relative position relationship between the retention position of the part W and a gas supply position, and maintaining the part W is maintained in the prescribed junction attitude on the board B.
申请公布号 JP2002057450(A) 申请公布日期 2002.02.22
申请号 JP20000241131 申请日期 2000.08.09
申请人 UEDA JAPAN RADIO CO LTD 发明人 TAKAHASHI MASANOBU;YOKOYAMA YOICHI;SAKAGUCHI TAKESHI
分类号 B23K1/00;B23K1/012;B23K3/00;B23K3/02;B23K31/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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