| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for liquid treatment by which the purge gas consumption and treatment costs can be reduced. SOLUTION: This liquid treatment device performs liquid treatment by supplying a predetermined treatment liquid to a wafer and is equipped with a rotor as a holding means for holding a semiconductor wafer W, a discharge nozzle as a treatment liquid supply mechanism for discharging the treatment liquid towards the semiconductor wafer W, a motor as a rotary drive means for rotating the rotor, a spindle 23a for transmitting the rotary drive force of the motor, which is disposed so as to penetrate through a hole 88 formed in a wall surface of a treatment chamber, a gas supply mechanism for supplying a purge gas into the treatment chamber through a gap 89 so that the treatment liquid does not leak outside from the treatment chamber through the gap 89 formed between the outer periphery of the spindle 23a and the inner periphery of the hole 88 and a gas flow rate control mechanism for controlling the amount of the purge gas to be supplied by detecting the presence or absence of treatment liquid supply or a closed or open state of the treatment chamber.
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