发明名称 |
INSULATING NITRIDE LAYER AND ITS FORMATION METHOD, AND SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a nitride layer of high resistance and excellent insulation property which is suitable for III-V compound semiconductor device consisting of nitride and enables electrically good isolation while restraining lowering of conductivity of an active layer, and its formation method, and furthermore to improve characteristic of a semiconductor device by using the nitride layer. SOLUTION: An insulating nitride layer 3c is formed by doping a III-V compound semiconductor consisting of nitride mainly with IIB group element (especially, Zn) at a high density of 1×1017/cm3 or more. The semiconductor device such as AlGaN/GaN HEMT has the nitride layer below a GaN active layer 4. |
申请公布号 |
JP2002057158(A) |
申请公布日期 |
2002.02.22 |
申请号 |
JP20000241581 |
申请日期 |
2000.08.09 |
申请人 |
SONY CORP |
发明人 |
NAKAMURA FUMIHIKO;KURAMOCHI NAOYOSHI;KAWAI HIROHARU |
分类号 |
H01L29/73;H01L21/00;H01L21/20;H01L21/205;H01L21/318;H01L21/331;H01L21/335;H01L21/338;H01L21/762;H01L27/095;H01L29/20;H01L29/207;H01L29/22;H01L29/778;H01L29/812;H01L31/02;H01L31/0304;H01L33/02;H01L33/08;H01L33/14;H01L33/30;H01L33/32;H01S5/026 |
主分类号 |
H01L29/73 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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