发明名称 INSULATING NITRIDE LAYER AND ITS FORMATION METHOD, AND SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a nitride layer of high resistance and excellent insulation property which is suitable for III-V compound semiconductor device consisting of nitride and enables electrically good isolation while restraining lowering of conductivity of an active layer, and its formation method, and furthermore to improve characteristic of a semiconductor device by using the nitride layer. SOLUTION: An insulating nitride layer 3c is formed by doping a III-V compound semiconductor consisting of nitride mainly with IIB group element (especially, Zn) at a high density of 1×1017/cm3 or more. The semiconductor device such as AlGaN/GaN HEMT has the nitride layer below a GaN active layer 4.
申请公布号 JP2002057158(A) 申请公布日期 2002.02.22
申请号 JP20000241581 申请日期 2000.08.09
申请人 SONY CORP 发明人 NAKAMURA FUMIHIKO;KURAMOCHI NAOYOSHI;KAWAI HIROHARU
分类号 H01L29/73;H01L21/00;H01L21/20;H01L21/205;H01L21/318;H01L21/331;H01L21/335;H01L21/338;H01L21/762;H01L27/095;H01L29/20;H01L29/207;H01L29/22;H01L29/778;H01L29/812;H01L31/02;H01L31/0304;H01L33/02;H01L33/08;H01L33/14;H01L33/30;H01L33/32;H01S5/026 主分类号 H01L29/73
代理机构 代理人
主权项
地址