SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device comprising electronic components and bonding wires sealed of gel in which distortion and disconnection of the bonding wires are suppressed. SOLUTION: Electronic components are mounted on a plurality of ceramic boards 3 which are connected electrically with the electronic components through bonding wires. Each ceramic board 3 is sealed of silicon gel 13 and bonded with one heat dissipation fin 4. The ceramic board 3 is provided with connection terminals 5 and mounted on a mother board 1 through the connection terminals 5 with the connection terminals 5 being positioned by an arranging plate 6 such that the mother board 1 and the ceramic board 3 have a substantially perpendicular positional relationship.