| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which enables surface mounting of electronic components, without leaving gases produced by dip soldering to be mixed in through-holes. SOLUTION: The wiring board comprises a mounting part 4 provided on a board 1 for mounting an electronic component 3 composed of a component body 9 and leads 5 provided at a lower side 15 of the body 9, through-holes 6 provided at the mounting part 4 for inserting the leads 5 of the electronic component 3, and support bumps 10 formed near the through-holes 6 for supporting the lower side 15 of the body 9 with the mounting part. When the electronic component 3 is mounted on the mounting part 4, the body 9 is supported with the support bumps 10, leaving a gap 12 between the board 1 and the body 9 so as to degas the through-holes 6.
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