| 摘要 |
A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present module is mounted above the semiconductor wafer and the interior of the heat dissipation plate absorbs the high heat from the wafer, and heat energy is dissipated by means of the fins at the top portion of the heat dissipation plate. A plurality layers of skirts are provided at the surrounding of the heat dissipation plate and the number of layers o the skirts is dependent on the watt number of the wafer. |
