发明名称 STACKED CHIP SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having different types of power supply mixedly in which power supply/ground power supply lines can be enhanced, degree of freedom can be increased in the design of terminal arrangement, and noise due to simultaneous variation of outputs can be reduced. SOLUTION: A logic functioning through the same power supply is constituted as a multichip IC device for each IC device and the IC devices are stacked and packaged thus facilitating design of layout for enhancing the power supply/ ground power supply lines individually. Design of terminal arrangement can also be facilitated while taking account of noise being generated when a bi- directional terminal and an output terminal are varied simultaneously with regard to terminal arrangement. Consequently, reliability as an IC device is enhanced and increase of development period is suppressed.
申请公布号 JP2002057270(A) 申请公布日期 2002.02.22
申请号 JP20000240084 申请日期 2000.08.08
申请人 SHARP CORP 发明人 KITAURA TOMOHIRO
分类号 H01L25/18;H01L25/065;H01L25/07 主分类号 H01L25/18
代理机构 代理人
主权项
地址