发明名称 INSULATION STRUCTURE AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To achieve reliable insulation at low costs. SOLUTION: In this structure, an FPC 10 is applied onto the upper surface of a base material 1 via an adhesive 2, and an insulating protection layer 4 is formed on a conductor layer 3 formed in a prescribed pattern by applying a thermoplastic resin. A reactive heat-resistance-type thermoplastic resin such as a polyurethane resin can be used as the insulating protection layer 4.
申请公布号 JP2002057442(A) 申请公布日期 2002.02.22
申请号 JP20010015978 申请日期 2001.01.24
申请人 FUJIKURA LTD 发明人 TERUNUMA ICHIRO
分类号 H05K3/28;H05K1/02;(IPC1-7):H05K3/28 主分类号 H05K3/28
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