| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that it is difficult for a semiconductor device for power having an external lead to satisfy all electric, thermal and mechanical characteristics. SOLUTION: Semiconductor chips 1 and 2 are fixed on a supporting board by a brazing filler metal, with which a fusing point is low but wettability is satisfactory. Internal connecting members 7 and 8 for connecting non-linked external leads 5 and 6, which are not linked to the supporting board 3, and the semiconductor chips are fixed to the non-linked external leads 5 and 6 by a brazing filler member 15, with which wettability is adverse but a fusing point is high. |
