| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a semiconductor laser array package effectively increasing in number of laser light emitting units without vainly increasing a package size. SOLUTION: The semiconductor laser array package comprises a semiconductor laser array chip 11, a support substrate 15 having a positioning protrusion 15A formed at an outer peripheral edge to support the chip 11 and its accessory 13 and pins respectively penetrating a plurality of through holes Hi, and a cap 17 having a window 17A for emitting a laser beam and covering the chip 11 and the accessory 13 to fix a base 17B to the substrate 15. In this package, an outer diameter D (unit: mm) of the substrate 15 and a number N of the laser emitting units in the chip 11 satisfy conditions of N>=3, 1<=D-N<=4 and (D-2)/(N+2)>=0.64.</p> |
