| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for electronic components, that can cope with upward warpage and twisting reasons other than the dead weight of a circuit board, and can prevent junction fail from occurring between part and substrate-side electrodes, at soldering completion. SOLUTION: This soldering decide for electronic components places the electronic components for soldering by heating in a reflow device 2, after cream solder is printed on the circuit board 4. The soldering device has substrate warpage preventing tools 3a and 3b, and a pressing member 5. The upper and lower parts of the circumference of the circuit board 4 conveyed on a substrate conveyance member 1 in the reflow device 2 is put between the substrate warpage preventing tools 3a and 3b. The pressing member 5 presses the substrate warpage preventing tools 3a and 3b for conveying, in parallel with the substrate conveyance member 1.
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