| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of circuit devices, which enables a mounting of circuit elements on conducting paths without using a support board, such as a printed board, a ceramic board or a flexible sheet. SOLUTION: The manufacturing method of circuit devices is performed by a method, where a conducting foil 60 is prepared and isolation grooves 61 shallower than the thickness of the foil 60 are formed in the foil 60 removed at least the regions, which are used as conducting paths 51A and 51B, to form a plurality of the paths 51A and 51B. Circuit elements 52A and 52B, which are respectively decided to constitute each circuit device, are respectivey mounted on the paths 51A and 51B and the circuit devices are individually covered with an insulative resin 50 in such a way that the circuit devices are respectively filled in the isolation grooves 61. The surface on the side, where the grooves 61 are not provided, of the foil 60 is polished to a prescribed position to leave the continuity of the foil 60 with the outside.
|
