发明名称 Connecting material and connecting method
摘要 There is provided a connecting material which can form a detachable connecting structure. According to the connecting material, the connecting portion between a certain object and other object can be more readily formed, and said certain object can be more readily detached from said other object after the formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen and which is in the form of particles dispersed in the connecting material.
申请公布号 US2002022000(A1) 申请公布日期 2002.02.21
申请号 US20010805153 申请日期 2001.07.13
申请人 SUETSUGU KENICHIRO;GAMO TAKAHARU;HIBINO SHUNJI;MORITA YOSHIO;NAKATA MIKIYA 发明人 SUETSUGU KENICHIRO;GAMO TAKAHARU;HIBINO SHUNJI;MORITA YOSHIO;NAKATA MIKIYA
分类号 B23K35/02;B23K35/14;B23K35/26;C01B3/00;C01B3/50;H05K3/34;(IPC1-7):C01B6/24;H05K3/30;B23P17/00 主分类号 B23K35/02
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