发明名称 |
Polishing method and polishing apparatus |
摘要 |
A polishing method executes those serial processes described below: a theoretically ideal amount of removable object is computed; based on the comparison to the profile when actually processing a polishing object via a chemical-mechanical polishing process, a proportional constant k is sought, which is then utilized as a fixed value; a proper polishing time t is computed; the proper polishing time t is then input into a controller in conjunction with other parameters; by way of feeding a control signal CTL1 to an X-axis servo motor, the controller properly controls X-axis directional velocity of a polishing object; the controller also delivers another control signal CTL2 to a main-shaft spindle motor to control the number of its rotation and delivers another control signal CTL3 to a Z-axis servo motor to control Z-axial directional positioning of a processing head. |
申请公布号 |
US2002022438(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20010833809 |
申请日期 |
2001.04.13 |
申请人 |
SATO SHUZO;SUZUKI TAKASHI |
发明人 |
SATO SHUZO;SUZUKI TAKASHI |
分类号 |
B24B37/04;B24B37/07;B24B49/10;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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