发明名称 Polishing method and polishing apparatus
摘要 A polishing method executes those serial processes described below: a theoretically ideal amount of removable object is computed; based on the comparison to the profile when actually processing a polishing object via a chemical-mechanical polishing process, a proportional constant k is sought, which is then utilized as a fixed value; a proper polishing time t is computed; the proper polishing time t is then input into a controller in conjunction with other parameters; by way of feeding a control signal CTL1 to an X-axis servo motor, the controller properly controls X-axis directional velocity of a polishing object; the controller also delivers another control signal CTL2 to a main-shaft spindle motor to control the number of its rotation and delivers another control signal CTL3 to a Z-axis servo motor to control Z-axial directional positioning of a processing head.
申请公布号 US2002022438(A1) 申请公布日期 2002.02.21
申请号 US20010833809 申请日期 2001.04.13
申请人 SATO SHUZO;SUZUKI TAKASHI 发明人 SATO SHUZO;SUZUKI TAKASHI
分类号 B24B37/04;B24B37/07;B24B49/10;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B37/04
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