发明名称 CURABLE ADHESIVE SPLINTS AND METHODS
摘要 <p>Curable adhesive splints, methods of manufacturing the splints and methods of using the splints are disclosed. The splints include a curable splinting layer and an exposed pressure sensitive adhesive proximate a first major side of the splinting layer. The pressure sensitive adhesive is used to secure the curable layer in position to provide the desired immobilization. The curable splinting layer may be of any material that can be shaped and cured to provide the desired level of stiffness required for immobilization, such as, e.g., moisture-curable splinting material, etc. The curable adhesive splints may be molded or formed to a desired shape while still providing the stiffness required for immobilization after curing.</p>
申请公布号 WO2002013735(A2) 申请公布日期 2002.02.21
申请号 US2001005003 申请日期 2001.02.15
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