| 摘要 |
A wafer support member (1), and a method of changing local compressibility of a wafer support member (1) to provide a seal, includes, dispensing a curable sealant material (9) onto a resiliently compressible wager support member (1), the support member having pores (6) for directing either fluid borne pressure or fluid borne vaccuum between the wafer support member (1) and a backside of a wager to be supported, wicking the sealant material (9) into pores (6) of the wager support member (1), curing the sealant material (9) to provide a film closing each of the pores (6) that are intercepted by the sealant material (9), to change local compressibility of the edge margin (5) of the wafer support member (1), and provide a seal. |
