发明名称 |
MOUNTING METHOD AND MOUNTING DEVICE |
摘要 |
A mounting method and a mounting device in which articles having an electrode are bonded by coating the electrode (3) of at least one article (2) to be bonded with nonconductive paste (20) immediately after that electrode (3) is irradiated with energy wave or energy particles (4) for cleaning. Since the electrode of the article to be bonded is prevented effectively against primary oxidation and secondary oxidation and fluxless bonding is realized, the process is simplified and the quality of a bonded article can be enhanced.
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申请公布号 |
WO0215654(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
WO2001JP06551 |
申请日期 |
2001.07.30 |
申请人 |
TORAY ENGINEERING CO., LTD.;YAMAUCHI, AKIRA |
发明人 |
YAMAUCHI, AKIRA |
分类号 |
H05K3/34;H01L21/56;(IPC1-7):H05K3/34;H05K3/26;H01L21/60 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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