| 摘要 |
<p>A semiconductor device, in accordance with the present invention, includes a plurality of fuses (106) disposed on a same level in a fuse bank (104). A plurality of conductive lines (408) are routed through the fuse bank in between the fuses. A terminal via window (405) is formed in a passivation layer over the plurality of conductive lines and over the plurality of fuses, the terminal via window being formed to expose the fuses in the fuse bank.</p> |
