发明名称 Pair of FETs including a shared SOI body contact and the method of forming the FETs
摘要 A method of forming a silicon on insulator (SOI) body contact at a pair of field effect transistors (FETs), a sense amplifier including a balanced pair of such FETs and a RAM including the sense amplifiers. A pair of gates are formed on a SOI silicon surface layer. A dielectric bridge is formed between a pair of gates when sidewall spacers are formed along the gates. Source/drain (S/D) conduction regions are formed in the SOI surface layer adjacent the sidewalls at the pair of gates. The dielectric bridge blocks selectively formation of S/D conduction regions. A passivating layer is formed over the pair of gates and the dielectric bridge. Contacts are opened partially through the passivation layer. Then, a body contact is opened through the bridge to SOI surface layer and a body contact diffusion is formed. Contact openings are completed through the passivation layer at the S/D diffusions. Tungsten studs are formed in the contact openings.
申请公布号 US2002020877(A1) 申请公布日期 2002.02.21
申请号 US20010976728 申请日期 2001.10.12
申请人 MANDELMAN JACK A.;ASSADERAGHI FARIBORZ;HARGROVE MICHAEL J.;SMEYS PETER;ROHRER NORMAN J. 发明人 MANDELMAN JACK A.;ASSADERAGHI FARIBORZ;HARGROVE MICHAEL J.;SMEYS PETER;ROHRER NORMAN J.
分类号 H01L21/8242;H01L21/84;H01L27/108;H01L27/12;(IPC1-7):H01L27/01;H01L31/039;H01L21/00 主分类号 H01L21/8242
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